표 2. | Table 2. 각 시뮬레이션에 사용된 PCB의 치수 | Dimension of the PCB used in each simulations.

Parameter		Design-based (mm)	Variable-applied (mm)
Copper thickness		0.035	0.061
GND pad outer radius	Connector side	2	2
	Pogo pin side	2.55	2.55
GND pad inner radius		1	1.019
SIG pad outer radius		0.4	0.321
GND-SIG via pitch		0.8	0.8
Via outer radius		0.2	0.2
Via inner radius		0.18	0.143
Dielctric thickness		0.8	0.8