표 5. | Table 5. ATC사 알루미나 기판의 고전력용 도체공정 | High power metalization of ATC company Alumina PCB.

Metalization	Application	Attachment method	Metalization	Typical value
TiW-Au-Cu-Ni-Au	High power/low loss RF and power supply	Pb/SN, Au/Sn soldering epoxy wire bonding	TiW 300 to 1,000 Å	500
			Au 3000 to 5,000 Å	3,000 min.
			Cu 200 to 2,000 Å	500
			Ni 300 to 1,000 μin	50 min.
			Au 20 to 200 μin	150 min.